Vice President of ASIC Engineering at Morse Micro

Management, Sydney, New South Wales, Australia sydney engineering
Description
Posted 1 months ago

Morse Micro is seeking a VP of ASIC Engineering to join our executive leadership team. Do you want to utilise your expertise in wireless chip design, product roadmap planning/implementation and global team leadership to play an instrumental role in a scaling semiconductor startup?

You will lead and grow our Digital Top/Phy & Analog/RF chip teams and oversee the design and delivery of the next generation of Morse Micro’s Wi-Fi HaLow chips. You will report directly to the CTO and will be responsible for delivering complex mixed-signal wireless chips. You will work in a highly dynamic environment, ensuring the hardware architecture and product delivery strategies align across the organisation by working closely with executive leaders in the Software, Systems, Operations and Sales / Marketing teams.

The role is based in Sydney, Australia. There is the opportunity for visa sponsorship and relocation reimbursement for the right candidate. This is a new position in the organisation and we are looking for the right candidate to join Morse Micro as soon as possible.

Responsibilities include

  • Leading the global Digital Top/Phy & Analog/RF chip teams
  • Create a comprehensive technical implementation strategy that includes defining your teams’ deliverables, milestones, goals and responsibilities
  • Grow the global chip teams to ensure that engineering resources will meet the company’s needs inline with the technology roadmap
  • Coordinate with executive leaders in the Software, Systems, Test, Operations and Sales / Marketing teams to ensure optimal designs and delivery
  • Represent the vision, mission and values of our organisation by serving as a leader and mentor to all engineers, with an emphasis on Engineering Managers and Principal and Lead Engineers

Essential skills (You must have):

  • 15+ years experience architecting, designing and implementing wireless chips
  • Track record of building, leading and scaling global high performing ASIC teams
  • Experience with IEEE 802.11, 3GPP or similar wireless radio standards
  • Track record of on time delivery of complex projects

What we offer:

  • Opportunity to be a key member of a scaling semiconductor company
  • Competitive salary + excellent stock option package
  • Healthy work environment with sit/stand desks and large screens
  • Lots of snacks & drinks, including barista coffee & some of the world’s best beers

If you are interested in building the first 802.11ah chipset together with the inventors of Wi-Fi as our VP of ASIC Engineering, send us an email ([email protected]) or apply here.