Morse Micro is seeking a VP of ASIC Engineering to join our executive leadership team. Do you want to utilise your expertise in wireless chip design, product roadmap planning/implementation and global team leadership to play an instrumental role in a scaling semiconductor startup?
You will lead and grow our Digital Top/Phy & Analog/RF chip teams and oversee the design and delivery of the next generation of Morse Micro’s Wi-Fi HaLow chips. You will report directly to the CTO and will be responsible for delivering complex mixed-signal wireless chips. You will work in a highly dynamic environment, ensuring the hardware architecture and product delivery strategies align across the organisation by working closely with executive leaders in the Software, Systems, Operations and Sales / Marketing teams.
The role is based in Sydney, Australia. There is the opportunity for visa sponsorship and relocation reimbursement for the right candidate. This is a new position in the organisation and we are looking for the right candidate to join Morse Micro as soon as possible.
Essential skills (You must have):
What we offer:
If you are interested in building the first 802.11ah chipset together with the inventors of Wi-Fi as our VP of ASIC Engineering, send us an email ([email protected]) or apply here.