Physical IC Design Engineer at Morse Micro

Digital, Sydney, New South Wales, Australia sydney engineering design
Posted 22 days ago

Are you a Physical IC Design Engineer with experience in taking RTL to GDS-II at cutting edge technology nodes? Do you want to play a key role in building next-generation Wi-Fi chips that will truly enable the Internet of Things? Keen to make a real difference in a VC-backed startup and work in a dynamic & fun environment? Then join Australia’s fastest growing semiconductor company based in Sydney, Australia! You’ll work with the team that invented Wi-Fi 20 years ago, and help shape the future of Wi-Fi.

You will be responsible for taking our designs through a low power PnR & signoff flow. You will work closely and iteratively with the digital design engineers to ensure best-possible power and performance QoR, and help ensure design correctness through to tapeout. 

The ideal candidate has experience working in a small team and has set up and run a complete RTL to GDS-II flow before from scratch. 

We are open to sponsoring a work visa for the right candidate.

As our Physical IC Design Engineer, your responsibilities would include:

  • Owning the RTL to GDS-II flow
  • Developing and running of PnR and timing signoff flow
  • Experience implementing designs consisting of multiple power domains
  • Running IR drop and power analysis
  • Experience running RTL synthesis and DFT flow
  • Managing overseas PnR contractors
  • Interacting with frontend and analog teams to get the design through to tapeout whilst meeting performance and power metrics
  • Assist with gate-level digital and AMS chip verification
  • Providing overall technical expertise and brilliance

To be successful in this role, the ideal candidate would have the following skills and experience:

Essential skills (you must have):

  • BSc or MSc in Electrical / Electronics Engineering or Computer Science
  • ASIC design engineer with 5+ years of relevant industry experience
  • A deep understanding of digital design fundamentals including low power and multi-clock-domain design for mass-produced, mixed-signal chips
  • Expert user of:
    • Cadence Innovus or Synopsys IC Compiler for backend
    • Cadence Tempus or Synopsys PrimeTime for timing signoff
    • Cadence Voltus or Synopsys PrimePower for power signoff
  • Basic user of:
    • Mentor Tessent, Cadence Modus or Synopsys Testmax for DFT
    • Cadence Genus or Synopsys Design Compiler for synthesis
  • Experience with:
    • ECO implementation flows
    • Low power UPF / CPF flows
    • Scripting languages such as Perl or, Python
    • Revision control systems such as git or svn
    • Linux development environment incl shell, make, etc
  • Industry experience with advanced mixed-signal technology nodes
  • Excellent verbal and written communication skills
  • Ability to document - and keep updated - instructions on running and debugging flows
  • Strong analytical and problem-solving skills
  • A determination to deliver even when subject to time pressures
  • A hands-on, practical attitude

Bonus skills (these will make you stand out in your application):

  • Experience managing a small team of backend engineers
  • Gate-level verification in Cadence ncsim or Synopsys VCS
  • RTL coding in SystemVerilog, Verilog or VHDL

Who we are:

Morse Micro is a fabless semiconductor company building Wi-Fi HaLow (802.11ah) chips for the Internet of Things (IoT). We are a team of wireless experts that love to innovate and invent. Together, we are building the world’s lowest power Wi-Fi technology that will enable billions of IoT devices to connect securely to the internet. We are a global team with offices in Sydney & Picton (Australia), Irvine & Boston (USA), Bangalore (India) and Hangzhou (China).

Check out what it is like to work for us:

What we offer:

  • Competitive salary + excellent stock option package
  • Healthy work environment with sit/stand desks and large screens
  • Office perks such as stocked drinks fridge, snack bar and barista coffee
  • Newly fitted-out offices, with a relaxed, friendly work environment
  • Willing to sponsor a visa for the right candidate

How to apply:

If you are interested in building the first fully-integrated 802.11ah chipset together with the inventors of Wi-Fi, then send us your resume and application letter via the application form below.